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Smart Measurement Technology Sharing Series Lecture: Optical Full-Field Measurement Based on Digital Twin Technology

2022-03-04

In the context of a global digital revolution across various industries, the manufacturing sector has also begun to advance the digitalization of its entire product range, gradually transmitting products in the form of digital flows, internationally referred to as MBD (Model-Based Definition). The concept of MBD was proposed in the early 21st century, and with the enhancement of software and hardware technologies, as well as advancements in semiconductor-based industries, the evolution of MBD into the concept of digital twins has flourished. Fundamentally, a digital twin is a dynamic representation of the past and present behaviors or processes of a physical entity in a digital format, which helps improve enterprise performance. Creating a digital twin mainly focuses on two key areas: - The information requirements for the design of digital twins and the product lifecycle—from asset design to the on-site use and maintenance of assets in the real world; - The creation of enabling technologies that integrate real assets with their digital twins, allowing measurement data to flow in real-time with operational and transactional information in the core systems of the enterprise. Digital twins have become a benchmark for future industrial development; however, the precision issues between measurement and simulation have always constrained their progress! DIC (Digital Image Correlation) technology has undoubtedly become a focal point for the development of digital twin technology as a breakthrough for this bottleneck. DIC technology can perform full-field optical measurements, and when used at the measurement end of digital twin technology, its advantageous characteristics are significant. Especially with the emergence of the new FE-DIC (Finite Element Digital Image Correlation) technology, which directly calibrates and computes based on CAD documents, significantly reducing or eliminating the use of calibration plates in traditional DIC measurements, using MESH grids as the basis for calibration, and directly integrating simulation with actual measurements, truly achieving "virtual-real integration." This lecture will focus on FE-DIC technology and "virtual-real integration," using the products of the authoritative representative in this field, the French company EIKOSIM, as an example to discuss the future development directions and possibilities of digital twin technology.

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