Application of SPI-Tactilus® Surface Pressure Measurement System in Heat Dissipation Equipment - Contact Surface Pressure + Force Distribution + Thermal Stress Measurement

The Tactilus thermal analysis system allows engineers to more easily measure the actual contact pressure and distribution between heat sources and heat dissipation devices. Unlike traditional sensors, the Tactilus sensor, which is as thin as paper, can be conveniently placed between two contact surfaces, allowing you to test, control, and reposition the heat dissipation surface without the need for computational simulation and prediction.
The Tactilus® surface pressure measurement system records the pressure distribution and pressure magnitude at the contact surface using a pressure pad known as "electronic skin," and transmits the obtained data to powerful, user-friendly software based on the WINDOWS system for data post-processing. Each Tactilus sensor is precisely integrated into the "electronic skin" and has been calibrated and serialized before leaving the factory. The main advantages of Tactilus are its portability and the ability to synchronize data collection from up to 4 discrete thermal sensors. Tactilus uses advanced mathematical algorithms to intelligently separate data information signals from noise information, and employs advanced electronic shielding technology to minimize the impact of noise, temperature, and temperature variations on measurement accuracy.