Thermal Exchange Applications of the SPI-Tactilus® Surface Pressure Measurement System - Thermal Stress Measurement + Thermal Stress Distribution + Heat Exchange Area

The design of the Tactilus thermal analysis system is aimed at allowing engineers to more conveniently measure the actual contact force and distribution between heat sources and heat dissipation devices.
For surfaces undergoing heat exchange, unpredictable thermal stresses often arise. Even slight thermal exchanges that lead to structural warping or a reduction in surface contact area can significantly impact the thermal efficiency of the equipment.
The Tactilus® surface pressure measurement system records the pressure distribution and pressure magnitude at the contact surface using a pressure pad known as "electronic skin." The obtained data is transmitted to powerful, user-friendly software based on the WINDOWS system for data post-processing. Each Tactilus sensor is precisely integrated into the "electronic skin" and has been calibrated and serialized before leaving the factory. The main advantages of Tactilus are its portability and the ability to synchronize data collection from up to 4 discrete thermal sensors. Tactilus employs advanced mathematical algorithms to intelligently separate signal information from noise and uses advanced electronic shielding technology to minimize the impact of noise, temperature, and temperature variations on measurement accuracy.