Senior HALT testing engineers share common product failure modes with you!

During the process ofHALT testingthe product's performance may undergo drastic or gradual changes. When the changes reach a certain level, the product will no longer function normally. This situation is referred to as product failure.

Failure modes caused by temperature:

Parameter drift and circuit stability

Open circuit, short circuit, common layer, etc.

Circuit board corrosion

Circuit board cracks, surface and via defects

Component defects

Loose components, etc.

Cold soldering, open soldering, or insufficient solder

Wire stretching or loosening, etc.

Poor contact

Fastener defects

Brittle fracture

Electromigration

Surge current

Metalization

Sealing failure, etc.

Failure modes caused by vibration:

Circuit open, short circuit

Loose components

Short circuit between adjacent components

Component pin breakage/defects

ICSocket defects

Cold soldering, open soldering, insufficient solder, or no soldering

Poor adhesion

Loose or poorly connected wires

Loose hardware

Loose fasteners or pads

Crystal defects

Mechanical defects

Packaging defects

Various failures caused by foreign objects, etc.

Failure modes caused by humidity:

Electrical short circuit

Active device jammed

Circuit board corrosion

Surface damage

Insulation material performance degradation

and other induced defects

Through long-term experience accumulation, our test engineers have summarized nine common failure modes based on the causes of product failures and provided images for reference:

1. Pin breakage

2. Cold soldering and open soldering

3.FLT

4.Wire loosening

5. Material defects

6.Burnout or explosion

7.Human factors

8. Structural defects

9.Normal wear

ForHALT testinganalyzed product failure modes, experienced engineers can quickly provide test reports, assess product reliability, and facilitate designers in improving processes and refining product designs.